綠志島金屬有限公司最新推出無鉛中溫Sn/Bi/Cu合金錫膏，型號：中溫錫膏PF-3005-C，具特性如下：

1. 熔點低（146～190℃），焊接溫度接近錫鉛錫膏，對元器件和板材耐熱性要求低，生產(chǎn)工藝窗口大；

2. 相對于目前常用的無鉛合金錫膏（如Sn/Ag/Cu或Sn/Bi/Ag），成本低；

3. 熱導(dǎo)性好，在散熱模組產(chǎn)品上應(yīng)用此產(chǎn)品，其熱導(dǎo)率比Sn/Bi合金增高一倍左右；

4. 此合金機械強度接近Sn/Ag/Cu合金。

4. 此產(chǎn)品采用球形度好、顆粒度分布均勻的錫粉煉制而成，粘度適中，適應(yīng)各種涂布方法；

5. 印刷滾動性、脫膜性及抗坍塌性均表現(xiàn)優(yōu)良，可有效解決密間距和小元件的焊盤印刷；

6. 潤濕性好，能適應(yīng)不同的金屬鍍層；焊后板面殘留極少且透明、阻抗高，焊點平滑飽滿；

7. 此款合金錫膏可作為Sn/Ag/Cu合金（表面貼裝和通孔涂布工藝）及Sn/Bi（散熱模組）類型產(chǎn)品的替代品；可有效地緩解焊料行業(yè)中對Ag需求的劇烈增加和避免無鉛的高溫焊接；解決了Sn/Bi焊料在散熱模組產(chǎn)品上的低熱導(dǎo)問題。

        Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.

附本錫膏應(yīng)用案例：

1、應(yīng)用于散熱器的焊接

2、應(yīng)用于表面貼裝